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DIP (Dual
In-Line Package)
= DIL (Dual In-Line)
Distance between
pins: 2.54mm (0.1 inch)
Distance between pin rows: 7.62mm (0.3 inch), 15.24mm (0.6 inch)
or 22.86mm (0.9 inch)
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PLCC (Plastic
Leaded Chip Carrier)
LCC (Leaded Chip Carrier)
Distance between
pins: 1.27mm (0.05 inch)
| Number
of pins |
Length |
Width |
Height |
| 18 |
13.39mm |
8.18mm |
3.40mm |
| 20 |
10.03mm |
10.03mm |
4.57mm |
| 28 |
12.57mm |
12.57mm |
4.57mm |
| 32 |
15.11mm |
12.57mm |
3.55mm |
| 44 |
17.65mm |
17.65mm |
4.57mm |
| 52 |
20.19mm |
20.19mm |
4.57mm |
| 68 |
25.27mm |
25.27mm |
4.57mm |
| 84 |
30.35mm |
30.35mm |
4.57mm |
| 124 |
42.93mm |
42.93mm |
4.57mm |
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TSOP
(Thin Small Outline Package) |
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QFP (Quad
Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)
| Number
of pins |
Length |
Width |
Height |
Pin
distance |
| 44 |
17.2mm |
17.2mm |
2.90mm |
0.8mm |
| 64 |
17.2mm |
17.2mm |
2.90mm |
0.8mm |
| 80 |
17.2mm |
17.2mm |
2.90mm |
0.65mm |
| 136 |
31.2mm |
31.2mm |
3.30mm |
0.8mm |
| 168 |
31.2mm |
31.2mm |
3.30mm |
0.65mm |
| Number
of pins |
Length |
Width |
Height |
Pin
distance |
| 54 |
25.6mm |
19.6mm |
2.90mm |
1.0mm |
| 60 |
25.6mm |
19.6mm |
2.90mm |
1.0mm |
| 64 |
25.6mm |
19.6mm |
2.90mm |
1.0mm |
| 80 |
25.6mm |
19.6mm |
2.90mm |
0.8mm |
| 100 |
25.6mm |
19.6mm |
2.90mm |
0.65mm |
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SOIC (Small
Outline IC “Gull Wing Style”)
SSOP (Shrunk Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)
Distance between
pins (SOP): 1.27mm (0.05 inch)
Distance between pins (SSOP): 0.4mm (0.016 inch), 0.5mm (0.02 inch)
or 0.65mm (0.026 inch).
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