LEADING PROGRAMMING AND MEASUREMENT SOLUTIONS

Chip Packages

DIP Package

Chip within DIP packageDIP (Dual In-Line Package)
= DIL (Dual In-Line)

Distance between pins: 2.54 mm (0.1")
Distance between pin rows: 7.62 mm (0.3"), 15.24 mm (0.6") oder 22.86 mm (0.9")

PLCC Package

Chip within PLCC PackagePLCC (Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)

Distance between pins: 1.27 mm (0.05")

Number of pins Length Width Height
18 13.39 mm 8.18 mm 3.40 mm
20 10.03 mm 10.03 mm 4.57 mm
28 12.57 mm 12.57 mm 4.57 mm
32 15.11 mm 12.57 mm 3.55 mm
44 17.65 mm 17.65 mm 4.57 mm
52 20.19 mm 20.19 mm 4.57 mm
68 25.27 mm 25.27 mm 4.57 mm
84 30.35 mm 30.35 mm 4.57 mm
124 42.93 mm 42.93 mm 4.57 mm

TSOP and TSSOP Package

Chip within TSOP PackageTSOP (Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)

QFP, PQFP and TQFP Package

Chip within QFP PackageQFP (Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)

 

Number of pins Length Width Height Pin distance
44 17.2 mm 17.2 mm 2.90 mm 0.8 mm
64 17.2 mm 17.2 mm 2.90 mm 0.8 mm
80 17.2 mm 17.2 mm 2.90 mm 0.65 mm
136 31.2 mm 31.2 mm 3.30 mm 0.8 mm
168 31.2 mm 31.2 mm 3.30 mm 0.65 mm

 

Number of pins Length Width Height Pin distance
54 25.6 mm 19.6 mm 2.90 mm 1.0 mm
60 25.6 mm 19.6 mm 2.90 mm 1.0 mm
64 25.6 mm 19.6 mm 2.90 mm 1.0 mm
80 25.6 mm 19.6 mm 2.90 mm 0.8 mm
100 25.6 mm 19.6 mm 2.90 mm 0.65 mm

SOP, SOIC and SSOP Package

Chip within SOP PackageSOIC (Small Outline IC “Gull Wing Style”)
SSOP (Shrunk Small Outline Package)

Distance between pins SOP: 1.27 mm (0.05")
Distance between pins SSOP: 0.4 mm (0.016"), 0.5 mm (0.02") oder 0.65 mm (0.026").