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Chip Packages

DIP Package

Chip im DIP Gehäuse

DIP (Dual In-Line Package)
DIL (Dual In-Line)

Distance between pins: 2.54 mm (0.1")

Distance between pin rows: 7.62 mm (0.3"), 15.24 mm (0.6") oder 22.86 mm (0.9")

PLCC Package

Chip im PLCC Gehäuse

PLCC (Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)

Distance between pins: 1.27 mm (0.05")

TSOP and TSSOP Package

Chip im TSOP Gehäuse

TSOP (Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)

QFP, PQFP and TQFP Package

Chip im QFP Gehäuse

QFP (Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)

SOP, SOIC and SSOP Package

Chip im SOP Gehäuse

SOIC (Small Outline IC “Gull Wing Style”) SSOP (Shrunk Small Outline Package)

Distance between pins SOP: 1.27 mm (0.05")

Distance between pins SSOP: 0.4 mm (0.016"), 0.5 mm (0.02") oder 0.65 mm (0.026").