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Chip packages



Picture: DIP Package

DIP Package

DIP (Dual In-Line Package)
DIL (Dual In-Line)

Distance between pins: 2.54 mm (0.1")
Distance between pin rows: 7.62 mm (0.3"), 15.24 mm (0.6") oder 22.86 mm (0.9")

Picture: PLCC Package

PLCC Package

PLCC (Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)

Distance between pins: 1.27 mm (0.05")

Picture: TSOP and TSSOP Package

TSOP and TSSOP Package

TSOP (Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)

Picture: QFP, PQFP and TQFP Package

QFP, PQFP and TQFP Package

QFP (Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)

Picture: SOP, SOIC and SSOP Package

SOP, SOIC and SSOP Package

SOIC (Small Outline IC Gull Wing Style)
SSOP (Shrunk Small Outline Package)

Distance between pins SOP: 1.27 mm (0.05")
Distance between pins SSOP: 0.4 mm (0.016"), 0.5 mm (0.02") oder 0.65 mm (0.026").