Chip packages
DIP Package
DIP (Dual In-Line Package)
DIL (Dual In-Line)
Distance between pins: 2.54 mm (0.1")
Distance between pin rows: 7.62 mm (0.3"), 15.24 mm (0.6") oder 22.86 mm (0.9")
PLCC Package
PLCC (Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)
Distance between pins: 1.27 mm (0.05")
TSOP and TSSOP Package
TSOP (Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)
QFP, PQFP and TQFP Package
QFP (Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)
SOP, SOIC and SSOP Package
SOIC (Small Outline IC Gull Wing Style)
SSOP (Shrunk Small Outline Package)
Distance between pins SOP: 1.27 mm (0.05")
Distance between pins SSOP: 0.4 mm (0.016"), 0.5 mm (0.02") oder 0.65 mm (0.026").