The Hakko FR-810B offers a powerful combination of high air volume and strong heating power to remove components quickly and efficiently. The powerful hot air flow allows the repair of densely packed circuit boards with high heat capacity. This ensures a sufficiently high air flow rate that allows work to be carried out in a third of the usual time. This reduces thermal load on the circuit board and components. In addition to the tried and tested functions, the Hakko FR-810B also features the vacuum lift-off function and the lift-off indicator. Both features allow components to be removed safely without damaging the PCB. Thanks to its impressive performance and generous air volume, the Hakko FR-810B marks a further development in the field of SMD rework stations.
Highlights
Specifications
Model Name | FR-810B |
---|---|
Input Voltage | 220 VAC 60 Hz |
Power Consumption | 1200 W |
Airflow Capacity1 Dimensions (W x H x D) | 5-115 L/min 160 x 145 x 220 mm (6.3 x 5.7 x 8.7 in.) |
Weight | 1.5 kg (3.3 lb.) |
By presetting the lift-off function, a component can be lifted off automatically when the solder has melted. At this moment, the display indicates that a component is being lifted off. Even if the component and the solder joint are covered by the nozzle, the user can lift off the component easily and safely.
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